📑 Index

  1. ESD Debug — Master Reference
    1.1 Damage channels · 1.2 Stress models & pulse width · 1.3 Clamp trigger + snapback · 1.4 CDM vs HBM · 1.5 Diagnostic flow · 1.6 Pin grounding · 1.7 Test plan
  2. ESD Damage — First Principles
    Every ESD kill is either a current kill or a voltage kill
  3. ESD Debug Guide — Current vs. Voltage Damage
    Telling current damage from voltage damage on the bench
  4. Rpo Ballasting Fail — 6-Finger NMOS Case Study
    Drain M1 resistance ladder: why ballasting fails · current-share table
📄 Pages
#PageWhat's insideStatus
#1 📕 Debug — Master Reference The big one: SV* problem, two damage channels, stress models, clamp AC trigger + snapback, CDM vs HBM diagnosis, terminology, diagnostic flow, pin-grounding configs, test plan & fixes. LIVE
#2 🔬 Damage — First Principles Physics of failure: every ESD kill is either a current kill (thermal) or a voltage kill (dielectric). LIVE
#3 🧭 Guide — Current vs. Voltage Damage Bench-side guide for classifying a failure as current-type or voltage-type damage. LIVE
#4 🧱 Rpo Ballasting Fail Layout case study: 6-finger NMOS drain M1 resistance ladder (0/2/4 Ω) → uneven current share (~46/31/23%), why the near pair filaments first, and fixes. LIVE